The outline of bump bond process steps. (1) deposition of field metal
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A. Peacock's research works European Space Agency, Paris (ESA) and other places
Hans ANDERSSON, Principal Research Engineer
Hans ANDERSSON, Principal Research Engineer
Left) A 64 x 64 pixel GaAs array produced to qualify the bump bonding
A. Peacock's research works European Space Agency, Paris (ESA) and other places
Top: X-ray image of a standard sardine, shown in the lower image, taken
The outline of bump bond process steps. (1) deposition of field metal
Left) X-ray image of a line pair rule taken using an un-collimated
Left) X-ray image of a line pair rule taken using an un-collimated
PDF) GaAs array fabrication
The outline of bump bond process steps. (1) deposition of field metal
Hans ANDERSSON, Principal Research Engineer
The outline of bump bond process steps. (1) deposition of field metal
The outline of bump bond process steps. (1) deposition of field metal