Generic hybrid FPA with indium bump bonds [7].

A monolithically integrated plasmonic infrared quantum dot camera

Third-generation infrared photon detectors

Hybrid CMOS detectors for the Lynx x-ray surveyor high definition

Marcus H. Mendenhall's research works National Institute of Standards and Technology (NIST) and other places

Progress on AlGaN-based solar-blind ultraviolet photodetectors and

Marcus H. Mendenhall's research works National Institute of Standards and Technology (NIST) and other places

Brian SIERAWSKI, Research Associate Professor, PhD Electrical Engineering, Vanderbilt University, TN, Vander Bilt, Institute for Space and Defence Electronics

Emerging fine-pitch bump bonding techniques - ppt video online

Cumulative distribution of the Cramér-Rao lower bound on the

Cumulative distribution of the Cramér-Rao lower bound on the

Fabrication of indium bumps for hybrid infrared focal plane array

a) Simulated absorption efficiency of the detector versus incident

Hybrid UV Focal Plane Array (FPA), consisting of a back